Double Sided PCBs

- **Step 1: Design and Output** The first step in double-sided PCBs manufacturing is the design of the printed circuit board. The output will be a Gerber file containing detailed information about what components need to be included, where they should go, and any other necessary specifications. The manufacturer will use this file to create the boards. - **Step 2: From File to Film** Once the design is complete, the manufacturer will then use a special machine or software to create films that contain all of the necessary information to produce the board. This includes things such as tracks, pads, and drill holes. - **Step 3: Printing the Inner layers: Where Will the Copper Go?** The film from step 2 will be used to create the inner layers of the board. This is done using a machine that prints electrically conductive ink onto a substrate. The printed circuit board layers then have copper sheets bonded to them to complete each layer. - **Step 4: Removing the Unwanted Copper** Once the inner layers are complete, any unwanted copper is then removed. This process is known as ‘etching’, and it involves using a chemical solution in order to dissolve away the unwanted copper from each layer. - **Step 5: Layer Alignment and Optical Inspection** After the etching process is complete, the layers are then aligned to ensure that each layer is correctly placed. The alignment process is done using optical inspection, which allows for a precise alignment check between all layers. - **Step 6: Layer-up and Bond** Once the layers have been aligned, they are then bonded together in order to create one single board. This is done using a unique adhesive that is applied between each layer. - **Step 7: Drill** The next step involves drilling holes in the board to make room for components such as resistors and capacitors. This is done using a machine that drills through each layer simultaneously, meaning that all holes are perfectly placed on each layer. - **Step 8: Plating and Copper Deposition** Once the drilling is complete, a plating process is then used to deposit copper onto the inner and outer surfaces of the board. This creates a conductive layer that can be used for tracks and pads. - **Step 9: Outer Layer Imaging** The image from Step 2 will then be applied to the outer layer of the board, in order to create the tracks, pads and other features that were specified in the design. This is done using a machine that applies a special ink or film onto each layer. - **Step 10: Plating** Once the outer layers have been imaged, a plating process is then used to deposit copper onto the board’s surface. This plating process is used in order to create tracks and pads, which can then be connected to components. - **Step 11: Final Etching** Once the plating and imaging processes are complete, any unwanted copper is removed from the board’s surface using a chemical etching process. This etching process removes any unnecessary copper which could otherwise cause short circuits or other electrical issues. - **Step 12: Solder Mask Application** A solder mask is then applied to the board to protect it from any corrosion and reduce any potential contact between components that could result in short circuits. The solder mask is a special coating applied to the board’s surface, and it helps prevent damage. - **Step 13: Final Inspection** The final step in the PCBs manufacturing process is a thorough board inspection. This is done to ensure that all components are correctly placed, that any shorts or opens have been identified and corrected, and that the tracks and pads are connected correctly. Once the board has passed this final inspection, it is then ready for use!