Description
MicroVision Electronics provides simple to complex printed circuit board assembly, engineering, design & layout services for a variety of customers spanning across a wide range of technologies. We have a solid reputation in high speed digital, analog, and RF markets for single, double, and high layer count boards. Whether your project entails high speed constraint-driven requirements or basic I/O, our staff has the expertise to deliver a comprehensive design package that is well-managed and on-time. Specialized in machine and manual soldering, full board assembly with respect to BOM/Schematics. Component packages handled are 1206, 0603, 0402, 0201 etc., Can manually solder up to 15 mils pitch gull wing packages. Capable of launching connections underneath the BGA using thin enamel coated wires. Replacing BGA using micro stencils. Supported for Military application and LCA project boards. (LRDE, ADE, NAL, etc.,) Handled various types of BGA packages: 50 mils, 40 mils, 32 mils, 20 mils, 18 mils. Our Technicians will assist during the time of testing and debugging at customer’s labs. We can handle Proto quantity by machine/Manual up to 10 boards to 1000 boards in a quick turn-around.