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Diamond Laser Cutting Machine SLDM-200

SIGMARADAR LASER TECHNOLOGY PRIVATE LIMITEDAhmedabad, GJ
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Anchored to the MCA registerCIN U29305GJ2018PTC104336
Price on request. Ask the factory for a quote.
MOQ 1 0 daysCurrency INR
Estimated delivery in about 5 days
Key attributesAll specs
Category
Laser Wafer Dicing Machine
Min. order
1 units
Lead time
0 days
Place of origin
Ahmedabad, GJ, India

Service

0-day production
Standard lead time once order is confirmed.

Highlights at a glance

  • Category: Laser Wafer Dicing Machine
  • Made in Ahmedabad, GJ, India
  • Minimum order: 1 units

Description

The SLDM-200 utilizes a non-contact laser dicing process to separate wafers into individual chips (dies) with extreme precision and minimal damage. Unlike conventional blade dicing, it ensures stress-free cutting, making it ideal for thin, brittle, and high-value wafers.

Key attributes

CategoryLaser Wafer Dicing Machine
Place of originAhmedabad, GJ, India
Minimum order1 units
Lead time0 days
Weight0 kg

Packaging & delivery

Gross weight per unit0 kg

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Know your supplier

SIGMARADAR LASER TECHNOLOGY PRIVATE LIMITED
Unverified<1 yr on BharatSealAhmedabad, Gujarat
Year founded
1998

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