Stencils

High precision stencils made with the best raw material available globally . Smallest size of aperture that can be cut is 40micron. Our design expertise and German engineered precision machines ensure optimum solder paste for BGA’s, QFN’s , IC’s, 01005 and various other types of components. We follow IPC standards and calculate the area ratio and aspect ratio to decide the thickness and modification required for the apertures.

Some components require more or less solder paste compared to the other components on the same board. A stencil of multiple thickness needs to be used to give the optimum solder paste for each component.  We use a special grade of SS , chemically etch the thickness and then laser cut the apertures.

Aculon’s latest nano coating technology to ensure smooth solder paste release and reduce the number of cleaning cycles. A two part wipes to be applied on the stencil which forms a nano coat within minutes. SPI machines accurately capture the improved solder paste release.

A mechanical deburring process to remove micro burrs that occur during the laser cutting process. Improved solder paste release . Get the maximum transfer efficiency !

Stencils without frames , used for prototype pcbs of small quantity where manual printing is done.

Alpha Tetrabond Frame and Foil

Space saving upto 70%. Better tension than closest frameless competitor. Compatible with Dek Vector Guard.