Ideal for all types of flexible packaging applications
High performance solvent-based and solvent-free options
Excellent chemical and heat resistance
High bonding strength
Suitable for lamination, metalized films, thermoformed chocolate packaging, polyethylene films, LDPE based / Transparent films lamination
Description
DIC India offers an extensive range of lamination adhesives that is ideal for all types of flexible packaging applications. We have an extensive range of high performance solvent-based and solvent-free lamination adhesives that offer excellent chemical and heat resistance with high bonding strength. For applications on lamination, metalized films, thermoformed chocolate packaging, polyethylene films, LDPE based / Transparent films lamination etc.
Key attributes
Category
Products & Solutions
Brand
DIC India
Place of origin
Kolkata, WB, India
Minimum order
0 units
Lead time
0 days
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