Anchored to the MCA registerCIN U36997GJ2014PTC080887
Price on request. Ask the factory for a quote.
MOQ not declared by manufacturerLead time not declared by manufacturerCurrency INR
Price on requestSynova Laser Technologies (India) Private Limited
Description
This diamond cutting system with a working area of 300 x 300 mm is particularly well suited for cutting larger diamonds having a size of 5 carats or more. It offers sawing and pie sawing capabilities for natural diamonds and coring and slicing of CVD diamonds. Read more
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